5.I want to print thicker We recommend the items highlighted in pink.
Murakami Co., Ltd.

As of April 2014 Murakami Co., Ltd.

Category No. Name Symbol or indication Anticipated results and Murakami’s features
Materials 1 Stainless mesh (ordinary) ST We provide appropriate advice for mesh selection
2 High-strength stainless meshView details ER/FR/ERH/GR/HS-D This is a high-strength mesh (improved line performance, increased accuracy, increased paste permeation amount), and an ultra high-strength material Tungsten mesh, “GR” is also available.
3 Black meshView details BS This improves resolution by blackening treatment of the mesh surface and achieves excellent resolution by adding blast processing
4 3D meshView details 3D This has greater paste permeation amount by increased gauze thickness
5 αMesh/βMeshView details α/β This is compatible with thin film printing, improves position accuracy, and improves emulsion adhesiveness as well as resolution by adding blast processing
6 CalendaringView details CAL/SH-CAL/U-CAL The gauze thickness is freely selectable (with some restrictions), ultra-thinning can be done with U-CAL and position accuracy is improved
7 Ni plated meshView details R The number of printing shots is increased by improved position accuracy
8 Blast processing (for stainless-type mesh only)
Patent No.: 3516882View details
BL/SBL/PBL Resolution and adhesiveness of photosensitive materials are improved and paste permeability is improved (BL: double-sided processing, SBL: S-side only, PBL: P-side only)
Gauze straining 9 Combination gauze strainingView details Combination/Hi Combination/S-Hi Combination Print performance is improved and stability of position accuracy is increased (Hi Combination: high tension applied, S-Hi Combination: ultra high tension applied)
10 Gauze straining roller processingView details RT The changes in initial position accuracy after printing begins is controlled (numerical control of small-sized frames by mechanization)
11 Resin coating for combination peripheral parts - The stability of print position accuracy is increased
12 PE processing for combination peripheral parts PE The stability of print position accuracy is increased (smoothing of the plate making surface by unification with the combination adhesive part)
Photosensitive material 13 High resolution direct method photosensitive material (SP-9901/D) SP-9901/D The resolution, wear resistance and solvent resistance are preferable
14 High resolution direct-indirect film photosensitive material
(IC10000/DP film/MS-O&M)
IC10000/D film/MS-O&M The resolution, wear resistance and solvent resistance are preferable, the smoothness of plate making print surface is improved and the variance in the thickness of the photosensitive material in the plate is reduced
15 Polar solvent-resistant photosensitive material(SP-9705)View details SP-9705 This is resistant to polar solvents such as NMP and alcohol
16 Super-resolution special photosensitive material
(TOUGHLEX hard type/soft type) View details
TAF(VH/VS)•TAFⅡNEW This has super-resolution, high solvent resistance (compared to our products) as well as selectable hardness of photosensitive materials
ToughlexⅡNEW View details
17 Reduced print bleeding photosensitive material (H5/SP-H)View details H5/SP-H The bleeding of the paste (running back) is reduced when printing and cleaning of the plate is made easier
Special processing 18 Flat processingView details F The smoothness of the plate making print surface is improved (option for direct method photosensitive material)
19 T processing/TU processingView details T/TU This prevents blurring when printing (option for direct-indirect film photosensitive material)
20 Stepped cut processingView details PK This forms a three-dimensional photosensitive material structure that tracks the shape such as unevenness of the surface of the printed object (but some restrictions apply to the shape)
21 Acid/alkali resistance special processingView details - This gives resistance to special pastes and inks such as those that contain acid or alkali
22 FT processingView details FT This is a processing that gives liquid drop removal performance to a photosensitive material and mesh, and this controls paste bleeding (running back) when printing
Exposure 23 Pseudo-parallel light exposure machine Standard The perpendicularity of the cross-section of the pattern opening section is preferable (in-house standard)
24 Parallel light exposure machineView details PB This adopts the same irradiation system as a semiconductor process and almost perfectly exposes parallel light (patterning)
25 Squeegee surface patterning exposureView details SHB This minimizes the occurrence of plate making pinholes up to a close proximity of the patterns
26 Squeegee surface non-pattern exposure SB This improves print durability and prevents pinholes in the periphery of the plate (in-house standard for stainless plates)
Inspection 27 Length measurement by pattern edge auto recognitionView details OGP/NEXIV This enables unmanned length measurement by pattern edge auto recognition, enhances teaching features and facilitates data storage of inspection history
28 3D laser microscopeView details VK-8500 This is a nondestructive measurement and analysis of plates and printed objects (measurement by laser light)
Other 29 Clean packView details Standard The plate is sealed inside a clean room (static protection, contamination and adherence prevention)
30 Moire occurrence prevention database - The gauze straining bias angle is set to prevent the occurrence of moire based on our abundant experience with each mesh and number of lines
31 Dot jump (tone jump) prevention plate makingView details - The dot jump (tone jump) when printing gradations is reduced by selecting the photosensitive material and adjusting the coating thickness
32 Metal + resin maskView details - A resin layer is added to the metal mask printing surface and this improves the tracking of the target printed object

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